Tetraclean Heat Sink Paste | Thermal Paste | Heat Sink Grease | White Thermal Paste High Temperature Compound | Used for PC, CPU, GPU, Chipset, and for Ovens Cooling
Non-returnable
Rs.299.00 - Rs.29,999.00
Tags:
- It helps disperse the heat from CPU to heatsink effectively.
- Features: High Performance, High temperature-resistance, Non-toxic, tasteless, non-corrosive.
- Suitable for: CPU, GPU ,heatsink, ovens, chipset, Xbox, High power LED and other PC components.
- Not electrically conductive and non-corroding thermal grease: no risk of short-circuits and safe to use with all types of heatsinks.
- Excellent ease of use and outstanding long-term stability. It should be stored in dry rooms at room temperature and in its original packaging.
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Product Details
Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste, or CPU grease) is a thermally conductive (but usually electrically insulating) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces (which act as thermal insulation) from the interface area in order to maximize heat transfer and dissipation. Thermal paste is an example of thermal interface material. Tetraclean Heat Sink Paste / Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU. This white color thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required. Product Features: *High Performance *High temperature - resistance *Low thermal resistance *Non-Electrical Conductive *Non-corrosive *Non-toxic Working principle: Filling the gap between the heating element and the cooling device, Increasing the contact area so as to achieve the soundest thermal conductivity effect. Helps disperse the heat from CPU to heatsink effectively. Wide range application: Suitable for: CPU, GPU, Heatsink, Ovens, Chipset, Xbox, High power LED, and other components. Excellent ease of use and outstanding long-term stability.
